 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| Low Capacitance ESD/EMI Protection for SIM Card PROTECTION PRODUCTS - EMIClampTM Description The EClampTM2465T is a combination EMI filter and line termination device with integrated TVS diodes for use on SIM Card interfaces on cellular phones and other portable electronics. This state-of-the-art device utilizes solid-state silicon-avalanche technology for superior clamping performance and DC electrical characteristics. The device consists of three circuits that include series impedance matching resistors for proper termination of the SIM card interface. Termination resistor value of 100 Ohms is included on the Reset and Data lines and 47 Ohms on the CLK line. TVS diodes are also included on each line for ESD protection in excess of 15kV (air discharge) and 8kV (contact discharge) per IEC 610004-2, level 4. An additional TVS diode connection is included for protection of the voltage (Vcc) bus. The ECLAMP2465T is in a 8-pin, RoHS/WEEE compliant, SLP1713P8T package. It measures 1.7 x 1.3 mm with a nominal height of only 0.4mm. The leads are spaced at a pitch of 0.4mm and are finished with lead-free NiPdAu. The small package makes it ideal for use in portable electronics such as cell phones and digital still cameras. ECLAMP2465T PRELIMINARY Features Bidirectional EMI/RFI filter with integrated TVS for ESD protection ESD protection to IEC 61000-4-2 (ESD) Level 4, 15kV (air), 8kV (contact) TVS working voltage: 5V Termination Resistors: 100 Ohms & 47 Ohms Capacitance: 10pF (Typical at VR = 0V) Protection and filtering for four lines Solid-state technology Mechanical Characteristics SLP1713P8T 8-pin package RoHS/WEEE Compliant Nominal Dimensions: 1.7 x 1.3 x 0.40 mm Lead Pitch: 0.4mm Lead finish: NiPdAu Marking: Marking Code + Date Code Packaging: Tape and Reel Applications SIM Card Cell Phone PDAs and Smartphones Pin Configuration Package Configuration 1.70 12 Data to Connector CLK to Connector 1 8 Data to IC CLK to IC Reset to IC 1.30 Gnd Reset to Connector NC 4 5 0.40 BSC Vcc to Connector 0.40 Pin Identification and Configuration (Top Side View) Revision 09/24/2008 1 8 Pin SLP package (Bottom Side View) Nominal Dimensions in mm www.semtech.com ECLAMP2465T PROTECTION PRODUCTS Pin Identification and Configuration Pin 1 2 3 4 5 6 7 8 Center tab Symbol Data CLK Reset NC Vcc Reset CLK Data GN D Identification Data Input (SIM Connector Side) Clock Input (SIM Connector Side) Reset Input (SIM Connector Side) N o Connect Power Supply ESD Protection (SIM Connector Side) Reset Output (IC Side) Clock input (IC Side) Data Output (IC Side) Ground connection PRELIMINARY 8 7 6 5 Gnd 1 2 3 4 Pin Configuration (Top View) Schematics & Component Values Vcc (Pin 5) 100 Data to Connector (Pin 1) Data to IC 47 100 (Pin 8) CLK to Connector (Pin 2) CLK to IC (Pin 7) Reset to Connector (Pin 3) Reset to IC (Pin 6) GND TAB (c) 2008 Semtech Corp. 2 www.semtech.com ECLAMP2465T PROTECTION PRODUCTS Maximum Ratings R ating ESD p er IEC 61000-4-2 (Air)1 ESD p er IEC 61000-4-2 (Contact) Junction Temp erature Op erating Temp erature Storage Temp erature Symbol VESD TJ Top TSTG Value +/- 18 +/- 10 125 -40 to +85 -55 to +150 PRELIMINARY Units kV o C C C o o Electrical Characteristics (T=25oC) P ar am et er T VS Reverse Stand-Off Voltage T VS Reverse Breakdown Voltage T VS Reverse Leakage Current Reset Series Resistors Clk Series Resistors Data Series Resistors Total Cap acitance S y m b ol VRWM V BR IR RRST R CLK Con d i t i on s Mi n i mu m Ty p i c a l M ax i m u m 5 Units V V A Ohms Ohms Ohms pF It = 1mA VRWM = 5.0V Each Line Each Line Each Line Inp ut to Gnd, Each Line VR = 0V, f = 1MHz 6 8 10 0.5 85 40 85 8 100 47 100 10 115 55 115 12 RDATA Cin Note: 1) ESD input at Pins 1, 2, 3, 5 (c) 2008 Semtech Corp. 3 www.semtech.com ECLAMP2465T PROTECTION PRODUCTS Typical Characteristics Typical Insertion Loss S21 (Pin 2 to 7) CH1 S21 LOG 6 dB / REF 0 dB 1: -6.33460 dB 537.824 MHz 2: -8.4201 dB 800 MHz 3: -9.1592 dB 900 MHz 2 3 PRELIMINARY Typical Insertion Loss S21 (Pin 1 to 8 and Pin 3 to 6) CH1 S21 LOG 6 dB / REF 0 dB 1: -8.7516 dB 506.218 MHz 0 dB -6 dB -12 dB -18 dB 4 1 2 3 0 dB -6 dB 1 2: -11.352 dB 800 MHz 3: -12.208 dB 900 MHz 4: -17.795 dB 1.8 GHz 5 -12 dB -18 dB -24 dB -30 dB -36 dB -42 dB -48 dB 4 4 4: -14.622 dB 1.8 GHz 5: -18.026 dB 2.7 GHz -24 dB -30 dB -36 dB -42 dB 5: -20.591 dB 2.5 GHz 1 MHz START.030 MHz 10 MHz 100 MHz 3 1 GHz GHz . STOP 3000 000000 MHz -48 dB 1 MHz START. 030 MHz 10 MHz 100 MHz 3 1 GHz GHz . STOP 3000 000000 MHz ESD Clamping (+8kV Contact) ESD Clamping (-8kV Contact) Note: Data is taken with a 10x attenuator Note: Data is taken with a 10x attenuator Normalized Capacitance vs. Reverse Voltage 1.1 1 0.9 0.8 C J(VR) / CJ(VR=0) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 f = 1 MHz Reverse Voltage - VR (V) (c) 2008 Semtech Corp. 4 www.semtech.com ECLAMP2465T PROTECTION PRODUCTS Device Connection The ECLAMP2465T designed with ease of layout in mind. The package has flow through design which allows the designer to route the signals straight in and out between the SIM port connector and the SIM controller. The device is in a 8-pin SLP package. Electrical connection is made to the 8 pins located at the bottom of the device. A center tab serves as the ground connection. Pin connections are noted in Figure 1. Note that the ESD protection diodes are located at pins 1 - 3 for the data and clock lines. This means the device is directional. Therefore, Pins 1 - 3 must be routed to the SIM connector while pins 6 - 8 are routed to the protected IC. Pin 5 is routed to the Vcc pin of the SIM connector. Typical layout examples are shown in Figure 3. All path lengths should be kept as short as possible to minimize the effects of parasitic inductance in the board traces. The center tab should be connected directly to the ground plane. Multiple micro-vias are recommended in the device ground pad as shown in Figure 2. Multiple vias in the device ground pad will result in a lower inductive ground loop, increasing the ESD effectiveness of the device. PRELIMINARY Figure 1 - Pin Identification and Configuration (Top Side View) Data to Connector CLK to Connector 1 8 Data to IC CLK to IC Reset to IC Gnd Reset to Connector NC 4 5 Vcc to Connector Figure 2 - Recommended Layout Using Ground Vias Figure 3 - SIM Protection Layout Examples (c) 2008 Semtech Corp. 5 www.semtech.com ECLAMP2465T PROTECTION PRODUCTS Applications Information - Spice Model PRELIMINARY Vcc (Pin 5) 100 Data to Connector (Pin 1) Data to IC 47 100 (Pin 8) CLK to Connector (Pin 2) CLK to IC (Pin 7) Reset to Connector (Pin 3) Reset to IC (Pin 6) GND TAB ECLAMP2465T Spice Model Note: All TVS shown in the circuit use D1 Parameters Table 1 - ECLAMP2465T Spice Parameters Parameter IS BV VJ RS IB V CJO TT M N EG Unit Amp Volt Volt Ohm Amp Farad sec --eV D1 (T VS) 2E-15 7.5 0.775 1.05 1E-3 9E-12 2.541E-9 0.246 1.1 1.11 (c) 2008 Semtech Corp. 6 www.semtech.com ECLAMP2465T PROTECTION PRODUCTS Outline Drawing - SLP1713P8T PRELIMINARY A D B DIM PIN 1 INDICATOR (LASER MARK) E DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .015 .016 .017 .000 .001 .002 (.005) .006 .008 .010 .065 .067 .070 .047 .051 .055 .049 .051 .054 .008 .012 .016 .016 BSC .008 .010 .012 8 .003 .004 0.37 0.40 0.43 0.00 0.02 0.05 (0.13) 0.15 0.20 0.25 1.65 1.70 1.78 1.20 1.30 1.40 1.25 1.30 1.38 0.20 0.30 0.40 0.40 BSC 0.20 0.25 0.30 8 0.08 0.10 A aaa C A2 A1 C SEATING PLANE A A1 A2 b D D1 E E1 e L N aaa bbb 1 E1 N e/2 e D1 2 LxN E/2 bxN bbb CAB D/2 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - SLP1713P8T P X DIM C G H K P X Y Z DIMENSIONS INCHES MILLIMETERS (.050) (1.27) .027 0.69 .012 0.30 .055 1.40 .016 0.40 .008 0.20 .023 0.58 .073 1.85 Z G Y K H (C) NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD SHALL BE CONNECTED TO A SYSTEM GROUND PLANE. FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR FUNCTIONAL PERFORMANCE OF THE DEVICE. (c) 2008 Semtech Corp. 7 www.semtech.com ECLAMP2465T PROTECTION PRODUCTS Marking PRELIMINARY Ordering Information Part Number Qty per Reel 3000 R eel Size 7 Inch PIN 1 INDICATOR 2465T XXXX EClamp 2465T.TCT This is a lead-free RoHS/WEEE Compliant Device EMIClamp and EClamp are marks of Semtech Corporation XXXX = Date Code Tape and Reel Specification Pin 1 Location User Direction of feed Device Orientation in Tape A0 1.51 +/-0.10 mm B0 1.91 +/-0.10 mm K0 0.66 +/-0.10 mm Tape Width B, (Max) D 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) D1 E 1.750.10 mm (.069.004) F K (MAX) P 4.00.1 mm (.157.004) P0 4.00.1 mm (.157.004) P2 T(MAX) W 8.0 mm + 0.3 mm - 0.1 mm (.312.012) 8 mm 4.2 mm (.165) 0.8 mm 0.05 (.031) 3.50.05 mm (.138.002) 2.4 mm (.094) 2.00.05mm (.079.002) 0.4 mm (.016) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 (c) 2008 Semtech Corp. 8 www.semtech.com |
Price & Availability of ECLAMP2465T
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |